Ormco Enlight Light Cure Adhesive Introductory Kit

Ormco Enlight Light Cure Adhesive

Ormco Enlight Light Cure Adhesive is a highly filled Bis-GMA resin adhesive system designed for superb handling and easy cleanup. Its highly active initiator system allows for reduced curing times, providing an efficient and reliable solution for orthodontic bonding.

Tooth Preparation

• Place lip/cheek retractor and saliva ejector in the mouth.
• Prophy the teeth thoroughly with pumice and water.
• Rinse with water using a high-speed evacuation system and dry the teeth with an air syringe.
• Apply the etchant solution to the bonding surfaces using applicator sponges. Gently dab (do not rub) continuously for 30 seconds.
• Rinse thoroughly with air-water spray and high-speed suction. Maintain a dry field; do not allow patient to rinse or contact etched enamel with saliva or mucosa.
• Dry etched enamel with clean air until it has a uniform, frosty appearance.

Bonding Procedure

• Dispense a small amount of sealant onto a mixing pad and apply a thin, uniform coating to the etched enamel from the gingival crest to cover all bonding surfaces. Replace the cap immediately after dispensing.
• Extrude a small amount of Enlight adhesive paste into the base of the bracket pad. Clean the tip and replace cap after use.
• Place the bracket onto the tooth immediately, adjust its position, and press firmly.
• Remove excess adhesive from the periphery of the bracket base.
• Cure adhesive using a Demetron Optilux 501 light:
  • 10 seconds for metal brackets (shine light on mesial and distal edges)
  • 5 seconds for ceramic brackets (shine light directly through bracket)
• Active archwires may be placed immediately after curing the last bracket.

Shelf Life & Storage

• Do not expose materials to intense light or elevated temperatures.
• Use Enlight at ambient temperature only.

Caution

• Etching Solution: Contains 37% phosphoric acid. Avoid contact with skin, eyes, and soft tissue. Flush immediately with water if contact occurs and seek medical attention for eyes. Do not ingest.
• Sealant and Paste: Avoid prolonged or repeated contact with oral tissues and skin. Wash affected areas with soap and water. Uncured material may cause contact dermatitis; discontinue use if irritation occurs. Use in a well-ventilated area and keep containers closed when not in use.

Ormco Enlight Light Cure Adhesive

Ormco Enlight Light Cure Adhesive is a highly filled Bis-GMA resin adhesive system designed for superb handling and easy cleanup. Its highly active initiator system allows for reduced curing times, providing an efficient and reliable solution for orthodontic bonding.

Tooth Preparation

• Place lip/cheek retractor and saliva ejector in the mouth.
• Prophy the teeth thoroughly with pumice and water.
• Rinse with water using a high-speed evacuation system and dry the teeth with an air syringe.
• Apply the etchant solution to the bonding surfaces using applicator sponges. Gently dab (do not rub) continuously for 30 seconds.
• Rinse thoroughly with air-water spray and high-speed suction. Maintain a dry field; do not allow patient to rinse or contact etched enamel with saliva or mucosa.
• Dry etched enamel with clean air until it has a uniform, frosty appearance.

Bonding Procedure

• Dispense a small amount of sealant onto a mixing pad and apply a thin, uniform coating to the etched enamel from the gingival crest to cover all bonding surfaces. Replace the cap immediately after dispensing.
• Extrude a small amount of Enlight adhesive paste into the base of the bracket pad. Clean the tip and replace cap after use.
• Place the bracket onto the tooth immediately, adjust its position, and press firmly.
• Remove excess adhesive from the periphery of the bracket base.
• Cure adhesive using a Demetron Optilux 501 light:
  • 10 seconds for metal brackets (shine light on mesial and distal edges)
  • 5 seconds for ceramic brackets (shine light directly through bracket)
• Active archwires may be placed immediately after curing the last bracket.

Shelf Life & Storage

• Do not expose materials to intense light or elevated temperatures.
• Use Enlight at ambient temperature only.

Caution

• Etching Solution: Contains 37% phosphoric acid. Avoid contact with skin, eyes, and soft tissue. Flush immediately with water if contact occurs and seek medical attention for eyes. Do not ingest.
• Sealant and Paste: Avoid prolonged or repeated contact with oral tissues and skin. Wash affected areas with soap and water. Uncured material may cause contact dermatitis; discontinue use if irritation occurs. Use in a well-ventilated area and keep containers closed when not in use.